Description:
Invention Description
Aerospace vehicles have many components that are subjected to high thermal and mechanical loading. In addition to heat and strength considerations, these components must be extremely lightweight in order to reduce associated fuel costs. The invention utilizes heat pipe concepts to improve heat transfer throughout cellular core panel structures. Specifically, these structures are well adapted to dissipate heat and withstand large static and dynamic forces, making them well suited for aerospace applications.
A published Patent Cooperation Treaty (PCT) application covering this technology is available as WO 2008/131105 A1.
Applications
This invention promises to significantly improve the performance of key components such as jet engine blades, disks and blisks; rocket engines; and leading edges of orbital and/or hypersonic aerospace vehicles, where high thermal fluxes and mechanical stresses can be encountered (e.g., during re-entry).
